Thermoelectric device and a method of manufacturing thereof
US5824561A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1995 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | May 19, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/01
Abstract
A method of making a thermoelectric device comprises forming electrodes on a surface of a first substrate and on a surface of a second substrate. Thereafter, a P-type thermoelectric material plate is bonded to the surface of the first substrate having the electrodes, and an N-type thermoelectric material plate is bonded to the surface of the second substrate having the electrodes. Each of the thermoelectric material plates are then processed by cutting and removing portions thereof to form P-type and N-type thermoelectric material chips bonded to the first and second substrates, respectively. Thereafter, the N-type thermoelectric material chips of the second substrate are bonded to the electrodes of the first substrate, and the P-type thermoelectric material chips of the first substrate are bonded to the electrodes of the second substrate to form PN-junctions between the first and second substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.