Polyamideamic acid resin prepolymers, high heat resistant polyamideimide foams prepared therefrom, and processes for preparing them
US5824766A · kind A · utility
2Cited by
8References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 16, 1996 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | Jan 16, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamideamic acid resin prepolymer represented by formula A having isophorone diamine as one of monomers, ##STR1## in which k, l, m and n are integer of 1 or more, respectively, and ##EQU1## --R-- is at least one group selected from the group consisting of ##STR2## --R'-- is a cis- and trans-conformational mixture of ##STR3## high heat resistant polyamideimide foam produced therefrom, and processes for producing them are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.