Patent · US Expired

Polyamideamic acid resin prepolymers, high heat resistant polyamideimide foams prepared therefrom, and processes for preparing them

US5824766A · kind A · utility

2Cited by
8References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 16, 1996
Grant dateOct 20, 1998
Priority date
Expiry dateJan 16, 2016

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08J2379/08
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A polyamideamic acid resin prepolymer represented by formula A having isophorone diamine as one of monomers, ##STR1## in which k, l, m and n are integer of 1 or more, respectively, and ##EQU1## --R-- is at least one group selected from the group consisting of ##STR2## --R'-- is a cis- and trans-conformational mixture of ##STR3## high heat resistant polyamideimide foam produced therefrom, and processes for producing them are disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.