Patent · US Expired

Miniature hydrostat fabricated using multiple microelectromechanical processes

US5824910A · kind A · utility

17Cited by
4References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 16, 1997
Grant dateOct 20, 1998
Priority date
Expiry dateApr 16, 2017

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01H35/34
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An improved hydrostat constructed on a silicon wafer by microfabrication methods similar to those used for integrated circuits and other devices. A thin section of the wafer acts as a diaphragm, responsive to pressure of ambient water. A lever arm is affixed at its first end to one point on the surface of the wafer and extends over the diaphragm, so arranged that the lever arm will be forced away from the wafer when pressure is applied to the diaphragm. The second end of the lever arm is moved by the diaphragm so that it moves further from the wafer, by a factor of the mechanical advantage of the lever. When the second end moves away from the wafer, it mechanically releases a lock, allowing an ordnance device to which the hydrostat is attached to arm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.