Semiconductor device provided with surface grounding conductor for covering surfaces of electrically insulating films
US5825080A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1996 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | Dec 18, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device provided with a semiconductor substrate having two surfaces opposing to each other and having a circuit including a transistor having a plurality of electrodes, the circuit is formed on at least one of the two surfaces. Insulating films are formed on the two surfaces of the semiconductor substrate, respectively, and connecting electrodes are formed on a surface of the insulating film and electrically connected to the circuit. Further, a surface grounding conductor is formed on a surface of each of the insulating films so as to cover the surface of each of the insulating films except for portions where the connecting electrodes are formed. Accordingly, any possible interference of the circuit formed on the semiconductor device with the external circuit can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.