Large integrated circuit with modulator probe structures
US5825194A · kind A · utility
5Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1996 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | Sep 20, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/2733
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of testing a large integrated circuit (10) of modular design. Test equipment is connected to a dedicated testing pad section (20) for each circuit section (22, 24, 34) of each module (12, 14, 16). The circuit section under test is tested via the testing pad adjacent that circuit section. The test equipment is then stepped to the testing section for the next circuit section. When testing is completed, the testing section is then electrically isolated from the circuit sections to prevent interference with operation of the entire circuit (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.