Electronic circuit board including a second circuit board attached there to to provide an area of increased circuit density
US5825630A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 1996 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | Nov 7, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computer baseboard providing localized support for high pin count, high density components. The baseboard includes a first circuit board capable of supporting low pin count electrical components. The first circuit board has a surface onto which the low pin count electrical components are mounted, and an area to which a second, smaller, circuit board is connected in a parallel arrangement with the first circuit board. The second circuit board has a first surface onto which high pin count electrical components are mounted, and a second surface physically and electrically connected to the area on said first substrate. The first and second circuit boards together provide support for electrical components having higher pin counts and densities than the first circuit board can support individually, such as high performance microprocessors and chipsets. The first circuit board may be a low circuit density substrate while the second circuit board is a high circuit density substrate or multiple substrate layer board. Additionally, the second circuit board can be constructed of materials with better electrical characteristics, such as Cyanate Ester or other material having a low relative p…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.