Method for connecting two substrates in a thick film hybrid circuit
US5825631A · kind A · utility
58Cited by
8References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 16, 1997 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | Apr 16, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Two hybrid circuit components are connected to one another by a ceramic block. Electrical connections are made between the hybrid components by conductive vias through the ceramic block. The ceramic block is disposed toward an edge of the hybrid components so that integrated circuits and/or discrete electrical components may be attached to a major portion of both surfaces of each hybrid substrate. The interconnected hybrid components form a compact electrical device, for example, a hearing aid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.