Integrated circuit heat sink with rotatable heat pipe
US5826645A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 1997 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | Apr 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An apparatus is a heat conducting connection between a heat pipe and a structure such as an integrated circuit heat sink. The heat sink contains a groove with extension tabs protruding above edges of the groove so that the tabs can be bent over to hold the heat pipe in the groove which is dimensioned to give a clearance space around the heat pipe. When the tabs are bent down far enough to deform the heat pipe or a heat conductive hardening material is used to fill the clearance space, the heat pipe is fixed in place. If the tabs are bent down to barely contact the heat pipe and a heat conductive non-hardening material is used to fill the clearance space, the heat pipe can still be rotated within the groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.