Clamping mechanism for a bonding apparatus
US5826778A · kind A · utility
11Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1996 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | Nov 22, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding apparatus provided with a clamping device for holding a workpiece such as a tab tape, comprising an upper clamper and a lower clamper which are respectively divided into two sections. The upper and lower clampers are respectively mounted on an upper clamper holding plate and a lower clamper holding plate so that the gaps between facing surfaces of the respective sections of the clampers can be adjusted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.