Pavement sealing product and method
US5827008A · kind A · utility
Inventors
Key dates
| Filing date | Jun 23, 1995 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | Jun 23, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31815
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A pavement repair structure and method of repair for forming a bond between vertical surfaces in asphalt pavement. The repair structure comprises a flexible, internal layer that is impregnated with an adhesive asphalt medium to define an elongated strip. An additive agent is incorporated in the asphalt medium to reduce the tackiness and lower the temperature sensitivity of the asphalt medium. A cut in the asphalt pavement caused by either a saw or a jack hammer is sealed by using the repair structure to form an extremely strong bond between the vertical cut edge of the pavement and the patch of new asphaltic concrete mix. The repair structure is also able to form a bond which is waterproof and will resist cracking due to extreme temperatures as a result of severe climatic conditions, the thermal expansion and contraction which the pavement will experience, and deflection of the pavement under traffic loading. The pavement repair structure has a thickness of 10-15 mm, and a varying width, with a melting point such that when in contact with hot asphaltic cement at normal mixing temperatures, the surplus free asphalt contained in the pavement repair structure will flow into the voids …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.