Treatment of glass substrates to compensate for warpage and distortion
US5827342A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1997 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | Apr 4, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S65/08
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for forming a substantially flat planar lightwave optical circuit which has a substantially flat planar silica substrate and a sintered glassy lightguiding layer over the silica substrate. The structure is given a post treatment at an elevated temperature for a time sufficient to flatten said structure and overcome any distortion caused by the difference in the coefficient of thermal expansion of the substrate and any glassy layers formed over the substrate. Alternatively, the silica substrate may be heated and presagged to a predetermined degree to compensate for distortion or warpage which will occur in later processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.