Monolithic integration of driver circuits with LED array and methods of manufacture
US5827753A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1997 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | Mar 20, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
Abstract
A method of fabricating a monolithically integrated LED array and driving circuitry includes sequentially forming overlying layers of material on the surface of a semiconductor substrate, the layers cooperating to emit light when activated. An insulating layer is formed on the layers and the layers are isolated into an array area and driver circuitry areas with row and column dividers dividing the array area into an array of LEDs arranged in rows and columns. Row and column driver circuits are formed on the insulating layer in the driver circuitry areas and row and column buses individually couple each LED in the array to row and column driver circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.