Non-destructive method of determining substrate tilt within a packaged semiconductor component
US5827970A · kind A · utility
7Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 1996 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | Sep 16, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2698
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A non-destructive method of determining substrate tilt within a packaged component includes providing the packaged component (10) with a component surface (32), providing a substrate (22) in the packaged component (10) wherein the substrate (22) has a substrate surface (33), using an acoustic wave (50) to measure a distance (34) between the component surface (32) and a region on the substrate surface (33), using another acoustic wave (53) to measure another distance (35) between the component surface (32) and a different region on the substrate surface (33), and comparing the distances (34, 35) to a threshold value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.