High pressure sensor apparatus with low cost compact packaging system
US5827972A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1993 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | Nov 2, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/147
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A fluid pressure sensor particularly useful for measuring pressure up to approximately 2000 psi has a hexport (12, 112, 212, 312) formed with a stop surface (26, 326) in a bottom wall (18) circumscribing a fluid pressure inlet (16). A pressure sensing module (22) is received on the stop surface and a distal end (40) of a wall (20, 120, 320) of the hexport is crimped to lock the pressure sensing module onto the stop surface with the stop surface limiting the amount of compression of an O-ring (30) disposed contiguous to and inboard of the stop surface. In one embodiment the crimp is placed directly on a metal ring (38) attached to a plastic connector (32) which in turn transfers the crimping force to the pressure sensing module. In other embodiments (FIGS. 2, 3) the crimp is placed directly in the pressure sensing module to form a subassembly. In one embodiment, a separate sleeve (142) member connects the subassembly to the plastic connector while in another embodiment the connector is provided with an extended skirt which snaps over the hexport to connect the connector to the subassembly. In yet another embodiment, the plastic connector (332) is formed with a strengthening flange (…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.