Semiconductor device with bonded wires
US5828116A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 21, 1997 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | Jan 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an improved method of wire-bonding on a semiconductor chip, especially a small acceleration sensor chip which is mounted on a substrate with an adhesive having low stress characteristics such as a silicon resin. Further, the present invention provides a semiconductor device having a structure in which the improved method of wire bonding is easily applicable. The wire-bonding is performed by giving ultrasonic vibrations to the wires and the pads on which the wires are bonded while imposing pressure thereon. The vibration is given in a direction along a radial line extending from the center of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.