Heatsink and method of forming a heatsink
US5829512A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 29, 1995 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Aug 29, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heatsink for dissipating heat from electronic components, such as integrated circuits, on a circuit board. The heatsink is formed from metal foil and comprises a series of coplanar base portions interposed with transverse fins. The heatsink can be constructed from a length of metal foil which is folded to form the base portions and transverse fins. A base layer comprising, for example, an additional strip of sheet metal material, has adhesive on both sides and is affixed to the base portions of the folded foil on one side and the surface of the electronic component using the adhesive on the other side. The foil or sheet material forming the base portions, fins and base layer of the heatsink are relatively thin and flexible such that lengths of the heatsink can be manufactured and coiled into rolls for transportation and storage. A portion of the heatsink can then be cut to length from the roll thereof and applied to a row of a plurality of components. Since the heatsink is flexible, a single strip of the heatsink can be applied to the surfaces of adjacent components even if the surfaces of those components are not coplanar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.