Bonded cast, pin-finned heat sink and method of manufacture
US5829514A · kind A · utility
42Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1997 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Oct 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high performance, high pin fin density heat sink (10) has mating first and second opposing base members (22, 24) having first and second pin fins (18, 20) extending generally perpendicularly therefrom. The pin fins (18, 20) are generally cylindrical and each bonded into recesses (30, 32) formed on the opposing base member (22, 24). The spaces between nearest adjacent first and second pin fins (18, 20) form narrow fluid passageways (12) having a gas inlet in (14) for communicating with a heat generating body and gas out let end (16).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.