Heat dissipator with multiple thermal cooling paths
US5829515A · kind A · utility
21Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 1996 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | May 10, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A technique for dissipating heat generated by a chip in a small, inexpensive, quiet, and reliable manner without drawing power from a power source. In a preferred embodiment, the chip resides in a computer housing and a heat dissipator for the chip is made up of a convection component and a conduction component. The convection component is similar to a conventional heat sink. It includes fins that channel a flow of air therethrough releasing heat into the air. The conduction component is a thermal conductor which attaches to a heat spreader. In the preferred embodiment, the heat spreader is part of the computer housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.