Polycrystalline diamond cutting element with diamond ridge pattern
US5829541A · kind A · utility
21Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1996 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Dec 27, 2016 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/5735
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
This invention relates to a novel domed polycrystalline diamond cutting element wherein a hemispherical diamond layer is bonded to a tungsten carbide substrate, commonly referred to as a tungsten carbide stud. Broadly, a pattern of ridges or bumps is integrally formed in the abrasive layer which ridges are designed to cause high localized stresses in the rock, thus starting a crack. By initiating cracks in localized areas, the crushing action could be performed with less force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.