Resin composition for use in the making of automobile bumpers and automobile bumpers made thereof

US5829804A · kind A · utility

Assignees

• MITSUI CHEMICALS, INC. · JP
• HONDA MOTOR CO., LTD. · JP

Inventors

• Yoshihisa Saeki · Saitama, JP
• Kenji Hamabe · Saitama, JP
• Kouzou Hayashi · Yokohama, JP
• Sachio Yokote · Yokohama, JP
• Hiromasa Marubayashi · Chigasaki, JP
• Hiroyuki Toshino · Tipp City, US
• Nobuhiro Imai · Kawasaki, JP
• Masaya Akiyama · Yokohama, JP

Key dates

• Filing date: Jun 25, 1996
• Grant date: Nov 3, 1998
• Expiry date: Jun 25, 2016

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B60R19/03
• WIPO field: Transport
• WIPO sector: Mechanical engineering

Abstract

Disclosed is a resin composition for the making of automobile bumpers comprising specified amounts of (A) a specific propylene-ethylene block copolymer, (B) a specific propylene homopolymer, (C) (C1) an ethylene-propylene copolymer rubber (EPM) and/or (C2) an ethylene-propylene-diene copolymer rubber (EPDM), (D) talc, and optionally (E) a polyhydroxy polyolefin. This resin composition shows an improvement in flexural modulus of elasticity and low-temperature impact resistance and also has good processability by injection molding, especially in terms of planar smoothness. Moreover, when component (E) is added, this resin composition provides automobile bumpers having adequate coating adhesion and hence excellent paintability. Thus, this resin composition is highly suitable for use in the making of automobile bumpers.