Copper wire

US5830583A · kind A · utility

Inventors

• Sidney J. Clouser · Chardon, US
• Rudolf Wiechmann · Freiberg, DE
• Bernd Schneider · Wiesbaden, DE
• Ulrike Bohmler · Emmendingen, DE
• R. Duane Apperson · McConnelsville, US
• Robert J. Fedor · Westlake, US
• Sharon K. Young · Tucson, US
• Roger N. Wright · Rexford, US
• Stephen J. Kohut · Chandler, US
• Susan S. Enos · Tucson, US

Key dates

• Filing date: Feb 3, 1997
• Grant date: Nov 3, 1998
• Expiry date: Feb 3, 2017

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/12431
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration of up to about 5 ppm and an organic additive concentration of up to about 0.2 ppm; cutting said foil to form at least one strand of wire; and shaping said strand of wire to provide said s…