Silicon micromachined motion sensor and method of making
US5831162A · kind A · utility
79Cited by
7References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1997 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Jan 21, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P15/0802
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for making and vacuum packaging a silicon micromachined motion sensor, such as a gyroscope, at the chip level. The method involves micromachining a trench-isolated sensing element in a sensing chip, and then attaching a circuit chip to enclose the sensing element. Solder bumps serve to attach the circuit chip to the sensing chip, form a hermetic seal to enable vacuum-packaging of the sensor, and electrically interconnect the sensing chip with the circuit chip. Conductive runners formed on the enclosed surface of the circuit chip serve to electrically interconnect the sensing element with its associated sensing structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.