Pressure sensor package and method of making the same
US5831170A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 4, 1996 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Apr 4, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4994
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor package and a method of producing the same. The package includes a pressure sensor base, a pressure sensor diaphragm positioned over the base, and a sealing ring positioned over the pressure sensor diaphragm and creating an interference fit with the pressure sensor base. The sealing ring forms a mechanical interference with the pressure sensor base by either positioning the ring within an under cut in a sidewall of the base or deforming a portion of the base over the top of the ring. The pressure sensor base includes a recess having a bottom surface and a groove in the bottom surface, and the sealing ring and/or the pressure sensor diaphragm is positioned within the groove. The package further includes external threads for securing the package to a threaded orifice, the external threads being positioned on the output side of the package, as defined by the diaphragm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.