Apparatus for spray-cooling multiple electronic modules
US5831824A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1996 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Jan 31, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20345
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The apparatus includes a substantially planar plate having a first side and a second side. A plurality of substantially planar fluid distributing manifolds are formed in the first side of the plate, each fluid distributing manifold having a surface recessed relative to at least a portion of the first side of the plate. A nozzle housing is located in the surface of each fluid distributing manifold. The nozzle housing is adapted to receive a nozzle and has a receptacle end and a spray end. The spray end has an aperture, and is in communication with the second side of the plate. The receptacle end is in communication with the surface of one of the plurality of fluid distributing manifolds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.