Integrated circuit IC package and a process for cooling an integrated circuit mounted in an IC package
US5831825A · kind A · utility
19Cited by
11References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 12, 1996 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Jun 12, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1532
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The heat dissipated by the integrated circuit (11) is evacuated into a plate (13) having an extended surface in order to transmit the heat into the integrated circuit package (10) and into the wiring board (12) by means of the input-output terminals (17) of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.