Heat dissipating device for central processing units
US5831829A · kind A · utility
Inventor
Key dates
| Filing date | Jul 18, 1996 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Jul 18, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/44026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating device for CPUs includes a dissipating device mounted on a CPU and having a transverse groove near either lateral positioning end, the transverse groove having a depth greater than a groove between every two adjacent dissipating plates of the dissipating device. A first positioning strip is bent to have a substantially vertical portion having a hook end for engaging a securing substrate of the CPU and a substantially horizontal portion having a slanting portion with a tongue for engaging one of the transverse grooves. A second positioning strip also has a slanting portion with a tongue for engaging the other of the transverse grooves. The second positioning strip further has a notch for engaging an indentation of a connecting element that comprises a substantially vertical portion with a hook hole for engaging the securing substrate of the CPU.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.