Bonding material and phase change material system for heat burst dissipation
US5831831A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 27, 1997 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Mar 27, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is disclosed herein an electronic circuit assembly using a bonding material/phase change material system for electronic device heat burst dissipation. One embodiment of the assembly comprises: a substrate having a substrate surface with a preselected mounting site located thereon; a predetermined amount of phase change material disposed on the substrate surface at the preselected mounting site; a predetermined amount of bonding material arranged on the substrate surface at the preselected mounting site so as to substantially surround the predetermined amount of phase change material; and an electronic device having a heatspreader portion, the device being oriented such that the heatspreader portion is positioned at the preselected mounting site over the predetermined amounts of phase change material and bonding material, the heatspreader portion being attached to the substrate surface by the bonding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.