Contoured adhesive wafer for ostomy appliance
US5834009A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1997 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Nov 3, 2017 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2013/4593
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An adhesive wafer for an ostomy pouch, and the combination of such a wafer and pouch, in which the adhesive layer of the wafer is composed of a hydrocolloid-containing skin barrier material and is contoured to provide a relatively thick body portion surrounded by a relatively thin peripheral portion, are disclosed. The wafer has a stoma-receiving opening, and the adhesive layer is of developed shape so that most, if not all, of the relatively thick body portion is located immediately below and to the sides of the stoma-receiving opening. The relatively thin peripheral portion of the adhesive layer is preferably embossed to provide a pattern of discrete, non-connecting depressions separated and isolated from each other by flat-top ridges dimensioned and arranged so that a skin surface engaged by said embossed surface primarily contacts only such ridges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.