Disc drive flex assembly having a low particulating circuit board
US5834084A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 5, 1997 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Jun 5, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A low particulating circuit board for a disc drive flex assembly, and a method for forming the same, are disclosed. The circuit board comprises a conductive metal substrate which has sufficient thickness to provide mechanical support and backplane suppression for the circuit board and to efficiently sink heat generated by preamplifier circuitry housed by the circuit board. The substrate has dielectric layers formed on the top and bottom surfaces thereof, the dielectric layers comprising an epoxy interleaved with nonparticulating fibers, such as tetrafluorethylene (TFE) fibers. Traces and pads are provided on the dielectric layers to provide the necessary electrical connections for the preamplifier circuitry. A plurality of circuit boards are formed from a panel and subsequently cut therefrom. Particulate generation is minimized through the use of the metal substrate, as well as recession of the substrate and the solder masks to reduce the amount of material cut during the cutting operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.