Chip carrier semiconductor device assembly and a method for forming the same
US5834338A · kind A · utility
33Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1996 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Sep 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip carrier semiconductor device comprises a semiconductor chip having a surface on which a plurality of contact pads, a tape carrier overlying the semiconductor chip and a plurality of leads provided on the tape carrier to overly the semiconductor chip, each of the leads having an inside end being provided with at last one bump for bonding a board, the bump being positioned on an inside area of the contact pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.