Patent · US Expired

Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin

US5834537A · kind A · utility

4Cited by
18References
34Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 24, 1996
Grant dateNov 10, 1998
Priority date
Expiry dateJun 24, 2016

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S525/906
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.