Methods and apparatus for the in-process detection of workpieces with a physical contact probe
US5834645A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1997 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Jul 10, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for detecting the presence of extraneous material on a polishing pad during a chemical mechanical planarization (CMP) process uses a contact probe assembly. The contact probe assembly interrogates the surface of the polishing pad during processing of a workpiece and generates a control signal indicating the presence of extraneous material when the displacement of a contact stylus exceeds a threshold amount. The contact probe assembly produces a control signal in response to the detection of extraneous material and the control signal causes the CMP system to react in an appropriate manner to reduce damage to the workpieces being processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.