Semiconductor device with improved heat dissipation efficiency
US5834831A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1996 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Mar 1, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thin semiconductor device in which a strength of a lead frame and a heat dissipation efficiency can be improved. The semiconductor device has a semiconductor chip, a lead having an inner lead and an a outer lead continuing to the inner lead, said inner lead having a thin plate portion thinner than the other portion therof, said thin plate portion being electrically connected to said semiconductor chip through a wire and said outer lead serving as an outer connecting terminal, and a sealing resin sealing said semiconductor chip and at least a part of said lead, wherin said inner lead of said lead is positioned on said semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.