Module mounting and adhesion systems and methods for electronic modules
US5834834A · kind A · utility
11Cited by
38References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1994 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Dec 1, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C11/41
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to mounting and adhesion systems and methods for compact electronic modules. More particularly, the present invention relates to an apparatus and technique for mounting an electronic module that is capable of communicating with an interface unit on a one-way-bus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.