Multilayer array ultrasonic transducers
US5834880A · kind A · utility
68Cited by
9References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 16, 1997 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Sep 16, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for fabricating "1.5D" and "2D" multilayer ultrasonic transducer arrays employs dicing saw kerfs, which provide acoustic isolation between rows. The kerfs are metallized to provide electrical connection between surface electrode layers and buried internal electrode layers. A multilayer piezoceramic transducer element for a "1.5D" or "2D" array produced by this method has higher capacitance, and accordingly provides better transducer sensitivity, in comparison to a single layer element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.