Passive microwave structure and methods having reduced passive intermodulation
US5834993A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1996 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Aug 20, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49865
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A simple joining process for members of passive microwave structures is described which reduces passive intermodulation. The process forms an aperture in a first member and forms a second member to have dimension which exceeds the aperture dimension by a dimension differential. The members are joined by initially causing them to have a temperature differential that is sufficient to permit the second member to be positioned across the aperture. The dimension differential is selected to generate mutually-induced radial stresses in the members, after the temperature differential is removed, which enhance the metal-to-metal contact between the members and, thereby, improve passive intermodulation (PIM) performance. Preferably, the dimension differential is selected to cause the second member to elastically buckle and exert a buckling stress against the first member. Additional interface structures are provided to resist operational axial forces, e.g., vibration, that tend to dislodge the members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.