Patent · US Expired

Movably mounted heat receiving plate

US5835348A · kind A · utility

12Cited by
3References
6Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 29, 1996
Grant dateNov 10, 1998
Priority date
Expiry dateOct 29, 2016

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F1/203
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

The present invention is to provide a heat sink used for a portable information processing apparatus, the casing of which has a recess in which an exchangeable arithmetic processor is accommodated. There is provided a heat receiving plate closely coming into contact with the arithmetic processor. The heat receiving plate includes a round hole portion arranged at one end. A heat pipe is inserted into the round hole portion. A fixing member is attached to the heat receiving plate at an outlet portion of the heat pipe arranged in the round hole portion. The heat receiving plate is fixed to the casing through the fixing member so that a hinge mechanism can be formed by the heat receiving plate and the heat pipe which is used as a fulcrum. At least a portion of the heat pipe is thermally connected with a radiating member.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.