Laser diode array packaging
US5835518A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1997 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Jan 31, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02492
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of packaging laser diode arrays includes the steps of forming a submount array having a plurality of submounts and an element for maintaining a precise spacing between the submounts; bonding the submounts to a substrate formed of an electrically insulating material; removing the element maintaining the precise spacing; and placing a diode bar in each of the precise spacings between adjacent submounts. For one embodiment of the invention, the submount array is formed by providing a plurality of submounts and a removable spacer between each pair of adjacent submounts, which spacers may be fixtured and are removed after the submounts are bonded to the substrate. For a second embodiment, the submount array is formed by machining a block of material from which submounts are to be formed into a plurality of submounts joined to each other by at least one attachment structure. After the submounts have been bonded to the substrate, the attachment structures may be machined away of otherwise removed. For the second embodiment, the submount array may have additional structures which may be used for alignment, mounting or other functions and selected features, able for a variety of fu…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.