Packed semiconductor device with wrap around external leads
US5835988A · kind A · utility
441Cited by
6References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 24, 1996 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Oct 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device with reduced thickness, improved heat radiation, and a stacked structure. Molded resin covers an IC chip wire and part of a die pad. The die pad is exposed from the molded resin. An external lead in the same plane as the exposed surface of the die pad extends to a side of the resin opposite the die pad and along the molded resin. This structure allows a reduction in thickness of the semiconductor device, the exposed die pad improves heat radiation, and the external lead on upper and lower surfaces of the resin allows the semiconductor devices to be stacked.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.