Method and apparatus for soldering inspection of a surface mounted circuit board
US5836504A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 1997 |
| Grant date | Nov 17, 1998 |
| Priority date | — |
| Expiry date | Feb 28, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
It is an object of the present invention to provide a method and an apparatus for soldering inspection of a surface mounted circuit board, which can improve an inspection accuracy by obtaining a highly accurate X-rays transmission image corresponding to a real shape of the mounted surface. An apparatus and a method for soldering inspection of a surface mounted circuit board, includes an one-side transmission image reading process (23), an one-side soldering inspection process (22,7), a both-side transmission image reading process (17), a response adjustment process (15,18) for adjusting responses of the one-side transmission image and both-side transmission image so as to make their response characteristics into uniform in a referred spatial frequency range on the basis of response characteristics to a spatial frequency concerning an image radiographic system and an image processing system at said reading processes, a subtraction process (19,16,20) for subtracting the adjusted one-side transmission image from the adjusted both-side transmission image in order to obtain an other-side transmission image, and an other-side soldering inspection process (21).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.