Heat reactivatable adhesive
US5837089A · kind A · utility
14Cited by
0References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 22, 1996 |
| Grant date | Nov 17, 1998 |
| Priority date | — |
| Expiry date | Apr 22, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention is a method of using a heat activatable adhesive for laminating vinyl sheet to wood. The organic solvent-free adhesive combines a reactive styrene-acrylic latex emulsion, an ethylene vinyl acetate copolymer emulsion, and a wax. After application to the vinyl substrate the adhesive is heat activated at temperatures as low as 160.degree. F. (71.degree. C.) and the laminate resists delamination at 190.degree. F. (88.degree. C.).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.