Memory card and method of producing same
US5837367A · kind A · utility
14Cited by
12References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 1996 |
| Grant date | Nov 17, 1998 |
| Priority date | — |
| Expiry date | May 1, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a memory card and its method of manufacture. The memory card has a flexible composite substrate formed from a top film, a base film, and an adhesive layer deposited between and bonding together the base film and the top film. Preferably, the thickness of such composite substrate is between 8 and 12 mils. A layer of metal is adhered to the exposed surface of the top film. A circuit layer is provided to form at least one site on the memory card which is readable by an external reading device. A protective layer is provided to overlie and protect the circuit layer of the memory card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.