Molded silicon carbide bodies
US5837631A · kind A · utility
6Cited by
4References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 1996 |
| Grant date | Nov 17, 1998 |
| Priority date | — |
| Expiry date | Nov 8, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B38/0051
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention relates to a microporous carbon-bound molded SiC body with granular SiC, secondarily formed SiC and a secondarily formed silicon compound, for use as inwall brick for lining a blast furnace as well as for use as susceptor for heating ceramic, electrically non-conductive molded bodies, inorganic melts, glasses and slags.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.