Ceramic substrate having pads to be attached to terminal members with Pb-Sn solder and method of producing the same
US5838069A · kind A · utility
37Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 1997 |
| Grant date | Nov 17, 1998 |
| Priority date | — |
| Expiry date | Mar 26, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ceramic substrate having on the surface thereof a plurality of pads to be attached to terminal members is provided. Each pad includes a metallic layer formed on the surface of the substrate and a connecting layer made of a nickel base alloy and formed on the metallic layer. A gold-nickel layer made of a gold base alloy containing nickel is formed on the connecting layer. The gold-nickel layer may be formed by first forming a gold layer on the connecting layer and then making nickel in the connecting layer to diffuse into the gold layer by heat treatment. A method of producing such a ceramic substrate is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.