Chip carrier to allow electron beam probing and FIB modifications
US5838159A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 22, 1996 |
| Grant date | Nov 17, 1998 |
| Priority date | — |
| Expiry date | Mar 22, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/307
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed are a die carrier and associated method for conducting probe beam tests on chips designed to be packaged in flip-chip packages. The die carrier is a specially modified membrane type carrier that includes a probe access region, such as an opening, in the membrane. A die to be tested is mounted in the die carrier such that its I/O pads make electrical contact with corresponding bump contacts on the membrane. The die/carrier assembly is then mounted in a test socket provided on a chip testing apparatus such that electrical I/O signals can be provided to and from an external test circuit. While the die is being electrical tested, a probe beam is directed through the probe access region and onto the chip active surface. In this manner, the chip active surface is probed while exposed to electrical stimulus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.