Processor card assembly including a heat sink attachment plate and an EMI/ESD shielding cage
US5838542A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1996 |
| Grant date | Nov 17, 1998 |
| Priority date | — |
| Expiry date | Sep 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The processor card assembly of the present invention includes a processor card, a metallic plate and a back cover. The processor card includes a circuit board having a processor mounted thereto. The circuit board includes a first and a second plurality of fastening features. The metallic plate has a third and a fourth plurality of fastening features. The third plurality of fastening features cooperate with the first plurality of fastening features for physically attaching and thermally coupling the processor to the metallic plate, to serve as a base for further thermally coupling the processor to a heat sink. The back cover has a fifth plurality of fastening features that cooperate with the second plurality of fastening features of the circuit board and the fourth plurality of fastening features of the metallic plate to allow the metallic plate and the back cover to physically and electro-magnetically form a Faraday cage enclosing the processor card to shield off electro-magnetic interference emissions and electrostatic discharge from the processor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.