Wafer wet treating apparatus
US5839456A · kind A · utility
148Cited by
4References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 20, 1997 |
| Grant date | Nov 24, 1998 |
| Priority date | — |
| Expiry date | Aug 20, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer wet treatment apparatus includes a first supply/discharge line, an outer bath connected to the first supply/discharge line, an inner bath within the outer bath, a second supply/discharge line connected to the inner bath, and at least one partition located on a portion of the inner bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.