Motherboard stiffener and guide for processor modules and PCI cards
US5839584A · kind A · utility
7Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1997 |
| Grant date | Nov 24, 1998 |
| Priority date | — |
| Expiry date | Jun 9, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1429
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structural foam, injection molded superstructure is attached to a motherboard by means of threaded inserts. The superstructure is formed with guide ways for CPU processor modules, and also for the edges of PCI cards. Features of the structure include cam levers on the CPU modules to install and extract the modules. A metal transverse vertical retaining bracket is attached to the superstructure to hold sides thereof parallel and prevent splaying of the free, open end of the superstructure upon extraction of CPU processor modules. The assembly provides stiffness to the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.