Aluminum-beryllium alloys having high stiffness and low thermal expansion for memory devices
US5840135A · kind A · utility
2Cited by
14References
1Claims
0Family size
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Key dates
| Filing date | May 2, 1996 |
| Grant date | Nov 24, 1998 |
| Priority date | — |
| Expiry date | May 2, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B21/083
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Articles of manufacture are made of aluminum-beryllium alloys having substantially randomly distributed aluminum-rich and beryllium rich phases to provide substantially isotropic mechanical properties, such as high stiffness and low co-efficients of thermal expansion, whereby the articles of manufacture provide more rapid and accurate responses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.