Patent · US Expired

Aluminum-beryllium alloys having high stiffness and low thermal expansion for memory devices

US5840135A · kind A · utility

2Cited by
14References
1Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 2, 1996
Grant dateNov 24, 1998
Priority date
Expiry dateMay 2, 2016

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG11B21/083
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

Articles of manufacture are made of aluminum-beryllium alloys having substantially randomly distributed aluminum-rich and beryllium rich phases to provide substantially isotropic mechanical properties, such as high stiffness and low co-efficients of thermal expansion, whereby the articles of manufacture provide more rapid and accurate responses.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.