Method for inhibiting the electrodeposition of organic particulate matter on copper foil
US5840170A · kind A · utility
6Cited by
7References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 30, 1992 |
| Grant date | Nov 24, 1998 |
| Priority date | — |
| Expiry date | Nov 30, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/13
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a process for electrolytic treatment of copper foil, comprising the steps of: (A) applying a voltage across an anode and cathode, wherein the anode and cathode are in contact with an electroplating composition containing a gelatin component; (B) removing organic particulate matter by contacting the electroplating solution containing the organic particulate matter with an adsorbent polymer; and (C) electrolytically treating the copper foil. The electroplating composition can additionally contain an active sulfur-containing component, such as thiourea.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.